About this role
WhiteCrow Research is seeking a Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering. You will develop and enable advanced package technologies for post-fab wafer finish and assembly, while driving yield, cost, and quality improvements across cross-functional teams. Ideal candidates have 2 years in semiconductor process integration, strong skills in Python, R, and SQL, and familiarity with DOE, SPC, and dashboarding to support data-driven decisions. J-18808-Ljbffr
About WhiteCrow Research
Frequently asked questions
What does a Principal Engineer, Advanced Packaging & Yield Innovation at WhiteCrow Research do?
WhiteCrow Research is seeking a Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering. You will develop and enable advanced package technologies for post-fab wafer finish and assembly, while driving yield, cost, and quality improvements across cross-functional teams. Ideal…
How much does a Principal Engineer, Advanced Packaging & Yield Innovation at WhiteCrow Research pay?
This role lists a salary of S$120 – S$180 per month.
Is this Principal Engineer, Advanced Packaging & Yield Innovation role remote, hybrid, or on-site?
The listing is based in Singapore. Check the posting for remote or hybrid options.
How do I apply for this Principal Engineer, Advanced Packaging & Yield Innovation role?
You can apply directly on WhiteCrow Research's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.