Senior Scientist Ii (Advanced Packaging), Ime

Job Description Research Scientists – Optical Interconnects for Next-Generation AI Clusters We are recruiting Research Scientists to join an ambitious research programme developing the next generation of ultra-high-bandwidth, ultra-energy-efficient optical interconnects for AI clusters. As AI models continue to scale to trillions of parameters, future AI infrastructure will depend on new interconnect technologies that can move enormous volumes of data between compute and memory nodes with much lower energy consumption. This project focuses on enabling petascale interconnects through advanced 2.5D/3D electronic-photonic integration, targeting optical I/O beyond 100 Tb/s per compute node, up to 10 Tb/s/mm bandwidth density, and ~1 pJ/bit energy efficiency. This is a unique opportunity to work at the intersection of advanced packaging, silicon photonics, high-speed interfaces, thermal design, and AI hardware systems. Successful candidates will contribute to technologies that are highly relevant to the future of hyperscale AI data centres and next-generation computing platforms. Our project aims to develop a 2.5D/3D integration-ready optical engine platform that brings optical communication much closer to the compute die. By tightly integrating electronic ICs (EICs) and photonic ICs (PICs) using advanced packaging and 3D integration approaches, the programme seeks to overcome the limitations of existing copper links and conventional co-packaged optics. The reserach project will explore: package architecture for dense electrical and optical I/O, high-speed EIC-PIC interface design, 3D stacked optical engine modelling, thermal and link-performance optimization, hybrid bonding and heterogeneous integration, simulation, characterization, and measurement of integrated modules. We are particularly interested in candidates who can contribute in one or more of the following areas: Research Scientist – Package Architecture, Link and Thermal Modelling You will develop models f…