Scientist, Advanced Packaging, Ime

Job Description About the Role A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientist to conduct R&D in thermal management, heat dissipation, and advanced cooling technologies for next-generation semiconductor packaging. The successful candidate will develop innovative thermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration, power electronics, and photonics applications. This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability, simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities, including simulation, testing, data analysis, prototype evaluation, and implementation of innovative thermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration, photonics, and power electronics. Key Responsibilities 1. Thermal Project Execution: To execute thermal engineering tasks for grant and/or customer-funded R&D projects. To Support project deliverables, timelines, experiments, and reporting. To Perform package thermal assessments and identify hotspot / cooling issues. To Generate technical data, reports, and presentation materials. 2. Thermal Simulation & Analysis: To conduct thermal modelling using tools such as ANSYS Icepak, ANSYS Fluent COMSOL Multiphysics and SIEMENS Flotherm. To perform steady-state and transient thermal simulations, junction temperature prediction and thermal resistance extraction, and thermal design optimization 3. New Cooling Technology Development: To support development and validation of new cooling concepts, including microchannel cooling, vapor chamber integration, immersion cooling and high-performance TIMs. To build prototypes and conduct proof-of-concept testing. 4. Thermal Characterization & Lab Work: To perform laboratory thermal measurements with IR thermography, thermocouple, thermal transient testing and flow / pressure drop testing. To correlate measured data with simulation results. 5. Cross-functional Collaboration: to work with package design, process integration, materials, and reliability teams. To support customer technical discussions and project reviews. To contribute to publications, patents, and technical proposals. Requirements PhD / master’s degree in mechanical engineering, materials science, electrical engineering, microelectronics, thermal sciences and related disciplines. 2+ years’ work experience in thermal management for semiconductor packaging preferred. Strong background in semiconductor package thermal design, electronics cooling, CFD / thermal modeling, experimental thermal characterization and materials for heat dissipation Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows and AI/HPC package challenges Experience in simulation tools and data analytics. Familiarity with JEDEC standards is advantageous. Strong communication and technical presentation skills. Strong industry engagement mindset. Collaborative and innovation-driven attitude.