Senior Scientist, Optical Interconnect Integration, Ime

Job Description Job Responsibilities: - Support optical interconnect integration using 2.5D and 3D advanced packaging approaches. - Understand and generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies. - Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners. - Develop advanced package-level and wafer-level optical interconnect solutions for Co-Packaged Optics (CPO) and heterogeneous integration platforms. - Perform optical simulation and analysis to assess coupling loss, alignment tolerance, package-stack effects, and interface-related optical performance. - Design and evaluate optical coupling structures, including grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces. - Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O integration. - Contribute to optical interconnect architectures for GPU–GPU, GPU–memory, and multi-chiplet system-level packaging applications. - Perform optical and electro-optical characterization of fabricated structures, including optical loss, coupling efficiency, high-speed modulation response, eye-diagram, and link-level performance evaluation. - Support package-level electro-optical testing of optical interconnect test vehicles using relevant optical, RF, and high-speed measurement setups. - Propose new concepts to improve optical coupling efficiency, alignment tolerance, manufacturability, and testability of next-generation CPO platforms. Requirements - Strong understanding of optical interconnect integration and advanced packaging concepts for Co-Packaged Optics (CPO) and heterogeneous integration platforms. - Knowledge of optical coupling mechanisms, optical loss sources, alignment tolerances, and package-induced optical performance variations. - Familiarity with photonic integration platforms such as Silicon Photonics (…