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Director, Advanced Packaging Lab (HIT)

Advanced Micro Devices, Inc

SingaporeFull-timeOn-site

Posted 17 May 2026

About this role

Establish and lead a multidisciplinary Advanced Packaging Lab in Singapore to accelerate AI product development. Define the technical roadmap and scale measurement capabilities across optical, electrical, mechanical, thermal, and imaging domains. Requires extensive experience in semiconductor packaging and metrology with a proven track record of managing and scaling technical teams. A degree in Mechanical/Electrical Engineering, Material Science, or Physics is required.

What they're looking for

Advanced PackagingMetrologyCharacterizationTechnical LeadershipOptical InterconnectsElectrical CharacterizationMechanical TestingThermal Evaluation

Frequently asked questions

What does a Director, Advanced Packaging Lab (HIT) at Advanced Micro Devices, Inc do?

Establish and lead a multidisciplinary Advanced Packaging Lab in Singapore to accelerate AI product development. Define the technical roadmap and scale measurement capabilities across optical, electrical, mechanical, thermal, and imaging domains. Requires extensive experience in semiconductor packag…

What skills does this Director, Advanced Packaging Lab (HIT) role need?

Key skills for this role include Advanced Packaging, Metrology, Characterization, Technical Leadership, Optical Interconnects, Electrical Characterization.

How much does a Director, Advanced Packaging Lab (HIT) at Advanced Micro Devices, Inc pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Director, Advanced Packaging Lab (HIT) role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Director, Advanced Packaging Lab (HIT) role?

You can apply directly on Advanced Micro Devices, Inc's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.