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SMTS Packaging Engineer

Advanced Micro Devices, Inc

SingaporeFull-timeOn-site

Posted 7 Jul 2026

About this role

Lead end-to-end package design execution for complex products, focusing on substrate layouts and advanced 2.5D/3D architectures. Collaborate with cross-functional teams and external vendors to optimize performance, cost, and quality while enhancing design methodologies. Requires a minimum of 8+ years of experience in complex substrate or interposer design with expertise in advanced packaging technologies. A Bachelor's degree or higher in Electrical or Computer Engineering is required, along with proficiency in EDA tools like Cadence or Synopsys.

What they're looking for

Package DesignSubstrate Layout2.5D/3D IntegrationChiplet-based ArchitecturesCadence SIPCadence APDSynopsys 3DICCSignal Integrity

Frequently asked questions

What does a SMTS Packaging Engineer at Advanced Micro Devices, Inc do?

Lead end-to-end package design execution for complex products, focusing on substrate layouts and advanced 2.5D/3D architectures. Collaborate with cross-functional teams and external vendors to optimize performance, cost, and quality while enhancing design methodologies. Requires a minimum of 8+ year…

What skills does this SMTS Packaging Engineer role need?

Key skills for this role include Package Design, Substrate Layout, 2.5D/3D Integration, Chiplet-based Architectures, Cadence SIP, Cadence APD.

How much does a SMTS Packaging Engineer at Advanced Micro Devices, Inc pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this SMTS Packaging Engineer role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this SMTS Packaging Engineer role?

You can apply directly on Advanced Micro Devices, Inc's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.