For this role, you will drive product quality initiatives during the new product development stage, with a focus on ensuring robust integration of semiconductor manufacturing equipment and maintaining high quality standards. You will collaborate closely with cross-functional teams including process integration, manufacturing, R&D, and suppliers to deliver world-class product reliability and performance. Key Responsibilities Lead quality assurance efforts for semiconductor manufacturing equipment, modules and incoming components, including qualification, reliability testing, failure analysis, and yield improvement. - Oversee and contribute to semiconductor equipment/machine integration projects, ensuring seamless process integration and compliance with quality requirements. - Drive quality initiatives during new product development (NPD/NPI), from design phase through volume production ramp-up. - Collaborate with process engineering, fabrication, and integration teams to establish and monitor quality metrics (e.g., SPC, defect reduction, KPI achievement). - Conduct root cause analysis for quality issues, implement corrective actions, and support customer complaint resolution (e.g., RMA, field returns). - Collaborate with Field Service Engineers on machine field performance and continuous improvement projects. - Contribute to cross-functional process improvements. - Travel to manufacturing sites, suppliers, or customer locations as needed to support integration, audits, or troubleshooting. Qualifications - Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field. - 3+ years of experience in quality engineering within the semiconductor industry. - Strong quality background, including experience with statistical process control (SPC), 8D/problem-solving methodologies, and Six Sigma practices. - Proven experience in semiconductor machine/equipment integration (e.g., process tool qualification, integration into fab lines). - Hands-on experience in new product development/introduction (NPD/NPI), including characterization (CTQ, Critical parameter etc.), qualification (test development, MSA etc.), and transfer to production (Work instructions, SOP, Inspection instruction etc.). - Willingness and ability to travel domestically and internationally (up to 30% as needed). - Excellent analytical skills, with proficiency in data analysis tools (e.g., JMP, Minitab) and semiconductor-specific processes. - Strong communication skills and ability to work collaboratively in a fast-paced environment. Preferred Skills - Die bonder usage and operation during high volume manufacturing - Knowledge of reliability testing, failure analysis, and yield enhancement. - Certification in quality tools (e.g., Six Sigma Black Belt, APQP). - Ability to read and write Chinese (both traditional and simplified Character). - Supplier and/or sub-contractor management experience. Candidate with less experience will be considered as Engineer, Product Quality.