Wafer Fab Process Engineer

Job Summary Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets. Key Responsibilities Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation). Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies. Drive new process integration (NPI) and process transfer to high-volume manufacturing. Perform root cause analysis and implement robust corrective/preventive actions. Define process control plans, SPC strategies, and OCAP execution. Collaborate cross-functionally with equipment, integration, quality, and R&D teams. Mentor junior engineers and technicians. Interface with suppliers on process and material improvements. Qualifications Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related). At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation. Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools. Demonstrated leadership in cross-functional technical projects. Strong analytical, problem-solving, and communication skills Preferred PhD in Engineering (Electrical, Chemical, Materials, or related). Six Sigma certification (Green/Black Belt). Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.