Package Design Engineer

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design. RESPONSIBILITIES: Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts. Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc. Schedule, prioritize, & track your work across multiple projects simultaneously General flip-chip BGA package design & engineering EDUCATION/EXPERIENCE & REQUIREMENTS: B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes Knowledge of package-level signal integrity and power integrity, to apply to package designs Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered. Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers. Good organizational and task management skills to manage multiple package design projects. PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS: B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. Experience with 2.5D and 3DIC packages is highly advantageous.