About this role
Responsible for the overall design, layout, and routing of complex flip-chip-BGA packages for high-performance ASICs. This includes managing signal and power integrity, thermal performance, and collaborating with global teams to enable new designs.
Requires a degree in Electrical Engineering with 3 to 8+ years of experience in flip-chip-BGA package design, specifically with high-speed SerDes. Proficiency in Cadence APD or equivalent tools and strong organizational skills for managing multiple projects are expected.
What they're looking for
Flip-chip-BGA Package DesignHigh-speed SerDesSignal IntegrityPower IntegrityCadence APDImpedance MatchingCrosstalk AnalysisThermal Management
Frequently asked questions
What does a Package Design Engineer at Broadcom do?
Responsible for the overall design, layout, and routing of complex flip-chip-BGA packages for high-performance ASICs. This includes managing signal and power integrity, thermal performance, and collaborating with global teams to enable new designs. Requires a degree in Electrical Engineering with 3 …
What skills does this Package Design Engineer role need?
Key skills for this role include Flip-chip-BGA Package Design, High-speed SerDes, Signal Integrity, Power Integrity, Cadence APD, Impedance Matching.
How much does a Package Design Engineer at Broadcom pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Package Design Engineer role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this Package Design Engineer role?
You can apply directly on Broadcom's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.