About this role
Drive and manage silicon bump and package assembly suppliers to achieve TQRDCEB goals. Support new product and technology introduction by defining processes and managing improvements across the backend supply chain.
Requires a PhD, Master's, or Degree in Mechanical, Electrical, or Electronics Engineering with 7-12 years of experience in advanced node silicon bumping and package assembly. Must be proficient in AutoCAD and experienced in Product Life-Cycle Management and TQM.
What they're looking for
Silicon BumpingPackage AssemblyNPIProduct Life-Cycle ManagementAutoCADFailure AnalysisTQMProject Management
Frequently asked questions
What does a Assembly Process & NPI Engineer at Broadcom do?
Drive and manage silicon bump and package assembly suppliers to achieve TQRDCEB goals. Support new product and technology introduction by defining processes and managing improvements across the backend supply chain. Requires a PhD, Master's, or Degree in Mechanical, Electrical, or Electronics Engine…
What skills does this Assembly Process & NPI Engineer role need?
Key skills for this role include Silicon Bumping, Package Assembly, NPI, Product Life-Cycle Management, AutoCAD, Failure Analysis.
How much does a Assembly Process & NPI Engineer at Broadcom pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Assembly Process & NPI Engineer role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this Assembly Process & NPI Engineer role?
You can apply directly on Broadcom's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.