Microelectronic Assembly Engineer

Key Responsibilities • Lead and oversee microelectronics assembly processes, including die attach, wire bonding, equipment setup, and process optimization. • Develop and qualify microelectronic packaging solutions, assembly processes, and documentation to support aerospace and defense products. • Support new product development (NPD), prototype builds, first articles, and pre-production, ensuring designs are manufacturable. • Work with RF ICs, substrates, capacitors, inductors, and other microelectronic components while ensuring compliance with quality and engineering standards. • Train and mentor assembly personnel, drive continuous process improvements, and support products throughout their lifecycle. Requirements • Diploma/Degree in Electronics, Mechatronics, or a related Engineering discipline with 5–7 years of microelectronics assembly experience in a manufacturing environment. • Strong knowledge of microelectronics assembly processes, packaging design, JEDEC/ISO standards, and operation of die attach, wire bonding, testing, and related assembly equipment. • Able to interpret technical drawings, design assembly jigs, and preferably proficient in 2D/3D CAD software. • Strong analytical, problem-solving, communication, and organizational skills with the ability to work independently and collaboratively. • Comfortable working under a microscope using precision hand tools, with excellent attention to detail, steady hand-eye coordination, and the ability to distinguish colors. Interested Parties please WhatsApp/Call us at 8893 3424 (Jasmine), and email your latest resume in WORD format to jl@businessedge.com.sg. You may call my office number at 65698233 (Ext.839) for a private & confidential discussion.