HP

Senior Thermal/Hardware Engineer

Hewlett Packard Enterprise Singapore Pte. Ltd.

D04 Harbourfront, Sentosa Island, Telok BlangahFull TimeS$6,000 – S$12,000/mo

Posted 25 Jun 2026

About this role

Job Family Definition: Designs, analyzes, develops, and evaluates thermal systems, electronics packaging, heatsinks, and enclosures for high-density, high-power networking platforms. Conducts thermal feasibility studies, design margin analysis, CFD simulation, and empirical validation testing on new and modified designs. Leads system-level thermal architecture development and assessment, driving design decisions across NPI program phases. Evaluates thermal reliability of materials, components, designs, and manufacturing techniques used in production. Directs and guides junior engineers, support personnel, and external partner organizations in detailed thermal design, lab testing, prototype fabrication, and production tooling development. Management Level Definition: Contributions impact technical components of HPE products, solutions, or services regularly and sustainable. Applies advanced subject matter knowledge to solve complex business issues and is regarded as a subject matter expert. Provides expertise and partnership to functional and technical project teams and may participate in cross-functional initiatives. Exercises significant independent judgment to determine best method for achieving objectives. May provide team leadership and mentoring to others. Responsibilities: Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms — from early concept through mass production — ensuring product performance, quality, and long-term reliability. Own the end-to-end thermal development lifecycle: heatsink design, CFD simulation, thermal mockup, in-lab testing, and data analysis. Design and validate thermal solutions for electronics enclosures, chassis, line cards. Define and execute thermal validation test plans (thermal margin, acoustics, shock/vibration, reliability, safety) Drive system-level design tradeoffs in collaboration with mechanical, electrical, power, firmware, and software engineering teams. Engage…

What they're looking for

AcousticsElectronics Packagingrelationships with external stakeholdersQuality Management

About Hewlett Packard Enterprise Singapore Pte. Ltd.

Industry: Manufacturing

Frequently asked questions

What does a Senior Thermal/Hardware Engineer at Hewlett Packard Enterprise Singapore Pte. Ltd. do?

Job Family Definition: Designs, analyzes, develops, and evaluates thermal systems, electronics packaging, heatsinks, and enclosures for high-density, high-power networking platforms. Conducts thermal feasibility studies, design margin analysis, CFD simulation, and empirical validation testing on new…

What skills does this Senior Thermal/Hardware Engineer role need?

Key skills for this role include Acoustics, Electronics Packaging, relationships with external stakeholders, Quality Management.

How much does a Senior Thermal/Hardware Engineer at Hewlett Packard Enterprise Singapore Pte. Ltd. pay?

This role lists a salary of S$6,000 – S$12,000 per month.

Is this Senior Thermal/Hardware Engineer role remote, hybrid, or on-site?

The listing is based in D04 Harbourfront, Sentosa Island, Telok Blangah. Check the posting for remote or hybrid options.

How do I apply for this Senior Thermal/Hardware Engineer role?

You can apply directly on Hewlett Packard Enterprise Singapore Pte. Ltd.'s careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.