About this role
Core Responsibilities 1. Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. 2. Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers. 3. Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, inc…
Frequently asked questions
What does a Senior/Staff Process Engineer (Wafer Dicing & Back-grind) at Lumilens do?
Core Responsibilities 1. Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. 2. Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting pa…
How much does a Senior/Staff Process Engineer (Wafer Dicing & Back-grind) at Lumilens pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Senior/Staff Process Engineer (Wafer Dicing & Back-grind) role remote, hybrid, or on-site?
The listing is based in Singapore. Check the posting for remote or hybrid options.
How do I apply for this Senior/Staff Process Engineer (Wafer Dicing & Back-grind) role?
You can apply directly on Lumilens's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.