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Senior/Principal Engineers (Advance Packaging Development)

Michael Page International Pte Ltd

IslandwideFull TimeS$10,000 – S$15,000/mo

Posted 25 Jun 2026

About this role

Work on cutting-edge advanced packaging platforms Strong technical growth in a fast-evolving space About Our Client Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next-generation process development and empowers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility-creating a workplace where top technical talent can build enduring careers. Job Description Drive development of advanced packaging technologies across: 🔹 Wafer-Level Engineering Develop and optimize wafer-level packaging processes (e.g. WLP, FO-WLP, RDL) Drive process improvements in lithography, bumping, and wafer preparation Enhance yield, performance, and manufacturability at wafer stage 🔹 Die-Level Engineering Develop and improve assembly processes such as flip-chip, die attach, and underfill Troubleshoot process issues related to alignment, bonding, and reliability Drive continuous improvement in packaging performance and yield 🔹 Integration Engineering Lead end-to-end process integration across wafer and die-level packaging Analyze yield and reliability issues across the full packaging flow Collaborate cross-functionally to ensure successful technology deployment The Successful Applicant Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field At least 5 years of experience in semiconductor process or packaging engineering Experience in advanced packaging technologies (e.g. WLP, flip-chip, assembly, integration) Strong problem-solving skills and ability to work across multiple teams What's on Offer You will have the opportunity …

What they're looking for

Assembly DesignMaterials ScienceLithographyCHIP-8

About Michael Page International Pte Ltd

Industry: Professional & technical services

Frequently asked questions

What does a Senior/Principal Engineers (Advance Packaging Development) at Michael Page International Pte Ltd do?

Work on cutting-edge advanced packaging platforms Strong technical growth in a fast-evolving space About Our Client Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organizati…

What skills does this Senior/Principal Engineers (Advance Packaging Development) role need?

Key skills for this role include Assembly Design, Materials Science, Lithography, CHIP-8.

How much does a Senior/Principal Engineers (Advance Packaging Development) at Michael Page International Pte Ltd pay?

This role lists a salary of S$10,000 – S$15,000 per month.

Is this Senior/Principal Engineers (Advance Packaging Development) role remote, hybrid, or on-site?

The listing is based in Islandwide. Check the posting for remote or hybrid options.

How do I apply for this Senior/Principal Engineers (Advance Packaging Development) role?

You can apply directly on Michael Page International Pte Ltd's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.