Micron Semiconductor Asia Operations Pte. Ltd. logo

Sr. Manager, Package Design/Development Quality Assurance (Open)

Micron Semiconductor Asia Operations Pte. Ltd.

D25 Kranji, Woodgrove, WoodlandsFull TimeS$10,000 – S$18,000/mo

Posted 8 Jul 2026

About this role

As a Package Design/Development Quality Assurance (DDQA) Senior Manager in Micron’s Global Quality (GQ) organization, you will lead a highly specialized engineering team responsible for enabling the successful introduction of Micron’s most advanced package technologies. This role is central to ensuring that chip‑package interaction risks, reliability concerns, and customer integration challenges are identified and mitigated early—before they impact product qualification, customer deployment, or field performance. You will work closely with Technology Development, Design, Assembly, and customer‑facing teams to drive deep technical understanding of package‑level failure mechanisms, define robust characterization and reliability strategies, and guide critical engineering trade‑offs. Beyond execution, this role offers the opportunity to shape next‑generation package technology by driving lessons learned into future designs, influencing industry practices, and publishing technical work that advances Micron’s leadership position. Success requires a leader who can combine technical authority, people leadership, and cross‑functional influence to deliver both near‑term results and long‑term technology impact. Responsibilities and Tasks Technical & DDQA Leadership Lead DDQA strategy for new package technology introductions, with focus on CPI and customer integration risks Drive early identification and mitigation of package‑level reliability and interaction risks Define and oversee characterization and reliability test strategies Guide development of fundamental understanding of package‑related failure mechanisms Ensure effective root cause analysis and closure of package technology quality issues Drive systematic capture and reuse of lessons learned in next‑generation technologies Act as a technical escalation point for package‑related customer quality and integration issues People & Team Leadership Lead, mentor, and develop a highly technical DDQA engineering team Set clear expectations, performance goals, and development plans for direct reports Build technical depth, engagement, and succession within the organization Foster a culture of accountability, collaboration, and technical excellence Technology Advancement & Industry Impact Drive internal and external technical publications related to package reliability and CPI Mentor engineers in technical writing and thought leadership Contribute innovative solutions that advance Micron’s package technology roadmap Operational Excellence & Governance Own resource planning and drive efficiency improvements Define and track DDQA performance metrics Ensure compliance with training, safety, and ethical standards Drive continuous improvement in processes, tools, and execution Experience 10+ years of experience in one or more of the following areas: • Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure Analysis Qualifications • Demonstrated ability to lead and develop senior technical engineers • Strong knowledge of semiconductor package assembly and surface‑mount processes • Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability • Working knowledge of industry reliability test methods, acceleration models, and sampling statistics • Experience applying FMEA and structured problem‑solving methodologies (e.g., 8D) • Strong analytical skills with the ability to translate complex data into clear technical decisions • Proven ability to collaborate across functions and influence outcomes in complex technical environments Develops, implements, and maintains technical quality assurance and control systems and activities. Defines and specifies the implementation of standards, methods, and procedures for inspecting, testing, and evaluating the precision, accuracy, and reliability of company products. Participates in the reviewing of engineering designs to contribute quality requirements and considerations. Assists product support areas in gathering and analyzing data. Selects, develops, and evaluates personnel to ensure the efficient operation of the function.

What they're looking for

Reliability TestingReliability AnalysisAccelerationReliability Engineering Management

About Micron Semiconductor Asia Operations Pte. Ltd.

Industry: Manufacturing

Frequently asked questions

What does a Sr. Manager, Package Design/Development Quality Assurance (Open) at Micron Semiconductor Asia Operations Pte. Ltd. do?

As a Package Design/Development Quality Assurance (DDQA) Senior Manager in Micron’s Global Quality (GQ) organization, you will lead a highly specialized engineering team responsible for enabling the successful introduction of Micron’s most advanced package technologies. This role is central to ensur…

What skills does this Sr. Manager, Package Design/Development Quality Assurance (Open) role need?

Key skills for this role include Reliability Testing, Reliability Analysis, Acceleration, Reliability Engineering Management.

How much does a Sr. Manager, Package Design/Development Quality Assurance (Open) at Micron Semiconductor Asia Operations Pte. Ltd. pay?

This role lists a salary of S$10,000 – S$18,000 per month.

Is this Sr. Manager, Package Design/Development Quality Assurance (Open) role remote, hybrid, or on-site?

The listing is based in D25 Kranji, Woodgrove, Woodlands. Check the posting for remote or hybrid options.

How do I apply for this Sr. Manager, Package Design/Development Quality Assurance (Open) role?

You can apply directly on Micron Semiconductor Asia Operations Pte. Ltd.'s careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.