Principal Engineer, Process Development, Thin Film

Job / Role Summary The Principal Engineer provides technical leadership for NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing. Success requires proven leadership in thin film module development, strong cross-functional influence, deep characterization and correlation capability, and strong judgment in technical tradeoffs for manufacturability, scaling, yield, and reliability. Main Responsibilities Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives. Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices. Oversee end-to-end development of process modules with focus on manufacturability, scalability, and integration readiness. Resolve complex technical challenges with significant business implications (root cause analysis, mitigation of process/device failures). Drive technology transfer and ramp-up activities to enable transition from R&D to high-volume manufacturing. Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/material utilization. Other Responsibilities Mentor senior engineers and influence technical direction across the organization. Represent the function in technical forums and strategic collaborations; benchmark against industry standards. Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives. Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work. Candidate Profile Minimum Qualifications / Experience PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, With demonstrated experience in Thin Films R&D/PD for NAND including CVD and Diffusion thin films Must-Have Technical Skills Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration. Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown). Proficiency in SPC/DOE/data analytics for optimization and fixing. Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery). Must-Have Soft Skills Technical leadership through influence; strong cross-functional and cross-site collaboration. Mentorship and clear executive-ready technical communication. Highly Desirable / Preferred Competitive benchmarking / industry trend assessment translating into actionable roadmaps. Embody Micron’s core values: People – Respect, develop and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value