Lead Staff Engineer / Lead Principal Engineer Pd Sg Diffusion/Implant

Lead, hire, mentor, and develop a team of Diffusion & Implant engineers, providing regular feedback, career development, and fostering a culture of collaboration, accountability, and technical excellence. Own and drive DF and IMP process module development, including cell development, process characterization, Integration, process margin improvement, and manufacturability for 3D NAND nodes. Drive execution of process development activities aligned with TD roadmap, ensuring timely delivery of robust, scalable, and high-performance solutions. Collaborate closely with Process Integration, Manufacturing Development, Equipment Engineering, and global TD teams to meet integration requirements and technology breakthroughs. Lead transfer of processes to high-volume manufacturing, supporting pilot ramp, yield improvement, and long-term process stability. Drive DOE-based experiments and data-driven methodologies to optimize process performance, expand process window, and improve cost effectiveness. Implement advanced process monitoring and control strategies to ensure stable, repeatable, and manufacturable performance. Identify and lead process simplification, cost reduction, and productivity improvement initiatives across multi-functional teams. Partner with equipment and materials suppliers to co-develop next-generation solutions, including early engagement, technology evaluation, and consumable qualification. Drive supplier execution and alignment, including performance targets, development timelines, and joint problem-solving to resolve process gaps and tool issues. Influence supplier roadmaps through regular technical engagement while partnering with Procurement and Operations on supplier strategy, selection, and deployment. Promote a strong safety culture and ensure alignment to Micron safety and IP protection policies. Drive adoption of sophisticated data analytics and AI or Machine Learning techniques to improve process understanding, enable predictive modeling, and accelerate process optimization and development. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Requirements: Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 6 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 3 years of semiconductor process development experience, with strong expertise in Thin films (Diffusion/CVD) and/or Implant processes. Minimum 2 years of experience leading or supervising engineering teams with demonstrated ability to develop talent and drive execution. Must be seen by current reports as an excellent mentor, team builder, motivator and technical expert with proven ability to solicit feedback, accept input, and analyze success/failure. Must possess thorough technical knowledge of DF/IMP processes. Understanding of various integration/structural impacts and constraints related to DF/IMP processes. Thin film experience is highly preferred. Experience working with suppliers and vendors on process development, qualification, and problem-solving. Experience transferring processes to manufacturing and supporting ramp and yield improvement. Working knowledge of DOE, data analysis, and statistical methodologies. Strong collaboration skills with global and multi-functional teams. Excellent communication skills with the ability to influence internal and external collaborators. Self-motivated and able to manage multiple priorities in a dynamic environment. Demonstrated ability to take calculated risks and drive innovative solutions.