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Engineer, Aptd Cem - Advanced Packaging Integration Engineering​

Micron Semiconductor Asia Operations Pte. Ltd.

D25 Kranji, Woodgrove, WoodlandsFull TimeS$5,000 – S$8,000/mo

Posted 6 Jul 2026

About this role

About Micron Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement. Key responsibilities and duties include: Technology Development: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity Integrate semiconductors while partnering with process and product engineering teams Yield Improvement: Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Conduct continuous data analysis to establish advanced controls and identify improvement opportunities Collaboration and Coordination: Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities Job Requirements: Bachelor’s or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking skills Effective communicator, able to collaborate across all levels Growth mindset with a passion for continuous learning Internship or experience in the semiconductor industry is a plus Demonstrated leadership and a track record of impact are highly desirable Interest in and knowledge of the semiconductor industry and Micron is preferred Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. Experience with Visual Basic for automation and tool integration is preferred. Embody Micron’s core values: People – Respect, develop, and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value What to Expect Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

What they're looking for

Analytical ApproachPreventive MaintenanceLeadershipFMEA

About Micron Semiconductor Asia Operations Pte. Ltd.

Industry: Manufacturing

Frequently asked questions

What does a Engineer, Aptd Cem - Advanced Packaging Integration Engineering​ at Micron Semiconductor Asia Operations Pte. Ltd. do?

About Micron Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to…

What skills does this Engineer, Aptd Cem - Advanced Packaging Integration Engineering​ role need?

Key skills for this role include Analytical Approach, Preventive Maintenance, Leadership, FMEA.

How much does a Engineer, Aptd Cem - Advanced Packaging Integration Engineering​ at Micron Semiconductor Asia Operations Pte. Ltd. pay?

This role lists a salary of S$5,000 – S$8,000 per month.

Is this Engineer, Aptd Cem - Advanced Packaging Integration Engineering​ role remote, hybrid, or on-site?

The listing is based in D25 Kranji, Woodgrove, Woodlands. Check the posting for remote or hybrid options.

How do I apply for this Engineer, Aptd Cem - Advanced Packaging Integration Engineering​ role?

You can apply directly on Micron Semiconductor Asia Operations Pte. Ltd.'s careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.