Package Silicon Technology Node Development Director/DMTS

This role focuses on providing technical leadership for developing and maintaining chip package interaction technology roadmaps and strategies for advanced silicon technology node transitions in packaging. Responsibilities include leading global technical silicon teams and collaborating with various engineering groups to ensure successful launches of future memory products. Candidates should possess significant experience (15+ years preferred) and expertise in process technology development, memory technologies, and chip-package-interaction failure mechanisms and risk assessments. A Master's or PhD degree in a relevant engineering or science field is preferred, along with a documented record of technical innovation and strong leadership and communication skills.