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Intern – Dry Etch Process and Equipment

Micron Technology

SingaporeInternshipOn-site

Posted 20 May 2026

About this role

The intern will participate in structured experimental studies to evaluate opportunities for improving dry etch process efficiency, reducing material costs, and minimizing process variation. They will also be responsible for creating an optimization proposal and delivering a technical presentation summarizing their findings. Candidates must be currently pursuing a degree in Engineering, Physical Sciences, or Statistical/Data Analytics. Strong interest in semiconductor manufacturing and the ability to work effectively in a team environment are required.

What they're looking for

Dry Etch ProcessSemiconductor ManufacturingEquipment DevelopmentData AnalysisExperimental DesignProcess OptimizationEngineering FundamentalsTechnical Presentation

Frequently asked questions

What does a Intern – Dry Etch Process and Equipment at Micron Technology do?

The intern will participate in structured experimental studies to evaluate opportunities for improving dry etch process efficiency, reducing material costs, and minimizing process variation. They will also be responsible for creating an optimization proposal and delivering a technical presentation s…

What skills does this Intern – Dry Etch Process and Equipment role need?

Key skills for this role include Dry Etch Process, Semiconductor Manufacturing, Equipment Development, Data Analysis, Experimental Design, Process Optimization.

How much does a Intern – Dry Etch Process and Equipment at Micron Technology pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Intern – Dry Etch Process and Equipment role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Intern – Dry Etch Process and Equipment role?

You can apply directly on Micron Technology's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.