About this role
The role focuses on transitioning next-generation memory and HBM packaging technologies from development to high-volume manufacturing. Key duties include performing risk assessments, implementing control plans, and integrating AI-assisted tools to improve operational efficiency.
A PhD in Chemical, Materials, Electrical, or Mechanical Engineering is required. Candidates must possess strong analytical skills and the ability to support operations via shift and weekend coverage.
What they're looking for
HBM PackagingNPIDesign of Experiments (DOE)FMEAStatistical MethodsAI LiteracyData AnalyticsPython
Frequently asked questions
What does a ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) at Micron Technology do?
The role focuses on transitioning next-generation memory and HBM packaging technologies from development to high-volume manufacturing. Key duties include performing risk assessments, implementing control plans, and integrating AI-assisted tools to improve operational efficiency. A PhD in Chemical, M…
What skills does this ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) role need?
Key skills for this role include HBM Packaging, NPI, Design of Experiments (DOE), FMEA, Statistical Methods, AI Literacy.
How much does a ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) at Micron Technology pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) role?
You can apply directly on Micron Technology's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.