About this role
Responsible for the startup, development, and optimization of wafer-level bonding processes to drive yield improvement and cost reduction. Collaborates across global sites and with suppliers to qualify equipment and ensure process consistency.
Requires a degree in Chemical, Materials, or Electrical Engineering with over 7 years of experience in semiconductor manufacturing or advanced packaging. Must possess strong technical knowledge of bonding processes and proficiency in statistical methodologies like DOE and SPC.
What they're looking for
Semiconductor BondingHybrid BondingFusion BondingData AnalysisSPCStatistical Modeling8D MethodologyFMEA
Frequently asked questions
What does a Principal Engineer, FE OCT CPEE ADT BOND at Micron Technology do?
Responsible for the startup, development, and optimization of wafer-level bonding processes to drive yield improvement and cost reduction. Collaborates across global sites and with suppliers to qualify equipment and ensure process consistency. Requires a degree in Chemical, Materials, or Electrical …
What skills does this Principal Engineer, FE OCT CPEE ADT BOND role need?
Key skills for this role include Semiconductor Bonding, Hybrid Bonding, Fusion Bonding, Data Analysis, SPC, Statistical Modeling.
How much does a Principal Engineer, FE OCT CPEE ADT BOND at Micron Technology pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Principal Engineer, FE OCT CPEE ADT BOND role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this Principal Engineer, FE OCT CPEE ADT BOND role?
You can apply directly on Micron Technology's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.