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Research Fellow (Semiconductor Advanced Packaging)

Nanyang Technological University Singapore

SingaporeFull-timeOn-site

Posted 26 Jun 2026

About this role

Develop and optimize a low-temperature Cu/dielectric hybrid bonding flow for fine-pitch 3D integration. Validate reliability and scalability through material characterization and the construction of prototype stacks. Requires a PhD in Materials, Microelectronics, EEE, or a related field with hands-on cleanroom experience in semiconductor processing. Must be proficient in material characterization tools and possess a strong reliability mindset for stress testing.

What they're looking for

Cu-Cu Hybrid BondingSemiconductor Process DevelopmentCleanroom OperationsSEM/TEM CharacterizationLithographyEtchingCMPPlasma Processing

Frequently asked questions

What does a Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University Singapore do?

Develop and optimize a low-temperature Cu/dielectric hybrid bonding flow for fine-pitch 3D integration. Validate reliability and scalability through material characterization and the construction of prototype stacks. Requires a PhD in Materials, Microelectronics, EEE, or a related field with hands-o…

What skills does this Research Fellow (Semiconductor Advanced Packaging) role need?

Key skills for this role include Cu-Cu Hybrid Bonding, Semiconductor Process Development, Cleanroom Operations, SEM/TEM Characterization, Lithography, Etching.

How much does a Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University Singapore pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Research Fellow (Semiconductor Advanced Packaging) role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Research Fellow (Semiconductor Advanced Packaging) role?

You can apply directly on Nanyang Technological University Singapore's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.