About this role
What they're looking for
Frequently asked questions
What does a Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University Singapore do?
Develop and optimize a low-temperature Cu/dielectric hybrid bonding flow for fine-pitch 3D integration. Validate reliability and scalability through material characterization and the construction of prototype stacks. Requires a PhD in Materials, Microelectronics, EEE, or a related field with hands-o…
What skills does this Research Fellow (Semiconductor Advanced Packaging) role need?
Key skills for this role include Cu-Cu Hybrid Bonding, Semiconductor Process Development, Cleanroom Operations, SEM/TEM Characterization, Lithography, Etching.
How much does a Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University Singapore pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Research Fellow (Semiconductor Advanced Packaging) role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this Research Fellow (Semiconductor Advanced Packaging) role?
You can apply directly on Nanyang Technological University Singapore's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.