About this role
Lead and sustain backend wafer level manufacturing processes including tape expansion, UV curing, and taping. Drive continuous improvement initiatives to optimize yield, reduce cycle time, and resolve chronic quality issues.
Requires a Bachelor's degree in Mechanical, Manufacturing, or related Engineering with at least 2 years of experience in semiconductor backend packaging. Proficiency in quality tools such as SPC, FMEA, and 6 Sigma is essential.
What they're looking for
Tape ExpansionUV CuringTapingReel-to-Reel Processes5-Why AnalysisFMEAControl PlanOCAP
Frequently asked questions
What does a Taping Process Engineer at Qualcomm do?
Lead and sustain backend wafer level manufacturing processes including tape expansion, UV curing, and taping. Drive continuous improvement initiatives to optimize yield, reduce cycle time, and resolve chronic quality issues. Requires a Bachelor's degree in Mechanical, Manufacturing, or related Engin…
What skills does this Taping Process Engineer role need?
Key skills for this role include Tape Expansion, UV Curing, Taping, Reel-to-Reel Processes, 5-Why Analysis, FMEA.
How much does a Taping Process Engineer at Qualcomm pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this Taping Process Engineer role remote, hybrid, or on-site?
This role is on-site, based in Singapore.
How do I apply for this Taping Process Engineer role?
You can apply directly on Qualcomm's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.