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Packaging Technology Integration, Staff Engineer

Qualcomm

SingaporeFull-timeOn-site

Posted 17 Jun 2026

About this role

Lead the end-to-end integration of packaging technology for RF Front End Modules, from wafer pre-assembly to high volume manufacturing. Manage technical interfaces with OSATs and drive yield, quality, and reliability improvements for Si and GaAs packaging processes. Requires a Master's or PhD in Engineering with 10+ years of experience in semiconductor packaging, specifically RF modules or SiP. Must have hands-on expertise in wafer-level interconnects, singulation technologies, and a strong foundation in statistics and FMEA.

What they're looking for

Semiconductor PackagingRF Front End ModulesWafer Pre-assemblyChip-to-Package Co-designNPIHigh Volume ManufacturingSiP ApplicationsCu Pillar Bumping

Frequently asked questions

What does a Packaging Technology Integration, Staff Engineer at Qualcomm do?

Lead the end-to-end integration of packaging technology for RF Front End Modules, from wafer pre-assembly to high volume manufacturing. Manage technical interfaces with OSATs and drive yield, quality, and reliability improvements for Si and GaAs packaging processes. Requires a Master's or PhD in Eng…

What skills does this Packaging Technology Integration, Staff Engineer role need?

Key skills for this role include Semiconductor Packaging, RF Front End Modules, Wafer Pre-assembly, Chip-to-Package Co-design, NPI, High Volume Manufacturing.

How much does a Packaging Technology Integration, Staff Engineer at Qualcomm pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Packaging Technology Integration, Staff Engineer role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Packaging Technology Integration, Staff Engineer role?

You can apply directly on Qualcomm's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.