Engineer, Staff (Ref: Td3088592)

Job Responsibilities: Technology Development Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release. Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans. Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets. Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met. Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching. Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria. Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps. Job Requirements: Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Semiconductor, etc.). 5+ years of experience in process integration engineering, technology development, or a high-volume manufacturing fab. Broad exposure to wafer-level packaging technology and processes. Demonstrated success leading cross-disciplinary technology integration projects. Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting. Excellent communication, technical documentation, and stakeholder management skills. Resourceful with critical thinking in problem solving. Project and priority management skills. Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing. Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc. Experience with scale-up from R&D → Pilo…