Associate Engineer, Equipment

Position Summary The Equipment Associate Engineer (DP/Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment. Responsibilities: Perform equipment Line Sustaining function (corrective maintenance),preventive maintenance, predictive maintenance, and calibration. Sustain and improve overall equipment performance (OEE). Update consumables/spare parts to ensure no delay in machine recovery due to no spare. Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement. Assist Engineers in setting up new machine and buy-off. Maintain good housekeeping and safety practices in the cleanroom. Communicate with supervisors, fellow shift personnel and vendors to resolve problems. Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents. Comply safety standards and procedures during shift duty or working in the production line. Responsible for maintenance and repairs on the assigned equipment. Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification. Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction. Any other ad-hoc duties as assigned. Requirements: Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent. Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection). Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.