Senior/Staff Lithography Process Engineer

As a Senior/Staff LithographyProcess Engineer, you will lead the development and optimization of lithographyprocesses for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball GridArray) packaging technologies. You will be responsible for driving keyengineering projects such as yield improvement, cost reduction, and processtransfers across global manufacturing sites. Key Responsibilities: Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB. Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting. Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer. Lead process improvements to enhance yield, throughput, and cost efficiency. Evaluate and implement new lithography materials (PSPI, PR) and tools. Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs. Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials. Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.). Support daily fab operations with issue resolution and yield improvement initiatives. Mentor junior engineers and provide technical direction to the litho team. Qualifications: Bachelor’s or Master’s degree in Engineering (Materials, Chemical, EE, or related field). 5+ years hands-on experience in photolithography process, preferably in advanced packaging (eWLB, WLP, FO-PLP). Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks. Skilled in project management, process transfer, and cost/yield improvement. Familiar with SPC, FMEA, and problem-solving methodologies. Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers. Fluent in both English and Chinese. (This role will need to liaise with cus…