ST

Intern Package Development (FA & CA)

STMicroelectronics

SingaporeInternshipOn-site

Posted 12 Jun 2026

About this role

Assist engineers with failure analysis report writing and WLCSP construction analysis within the Board Level Reliability R&D lab. Undergo comprehensive training in semiconductor assembly processes and lab equipment operation. Requires a diploma in Electronic Engineering, Electronic & Computer Engineering, or a similar field. Proficiency in Microsoft Office and business-level English is required, while basic semiconductor knowledge is preferred.

What they're looking for

Failure AnalysisWLCSP Construction AnalysisX-sectioningSemiconductor AssemblyMicrosoft PowerPointMicrosoft ExcelMicrosoft WordCommunication Skills

Frequently asked questions

What does a Intern Package Development (FA & CA) at STMicroelectronics do?

Assist engineers with failure analysis report writing and WLCSP construction analysis within the Board Level Reliability R&D lab. Undergo comprehensive training in semiconductor assembly processes and lab equipment operation. Requires a diploma in Electronic Engineering, Electronic & Computer Engine…

What skills does this Intern Package Development (FA & CA) role need?

Key skills for this role include Failure Analysis, WLCSP Construction Analysis, X-sectioning, Semiconductor Assembly, Microsoft PowerPoint, Microsoft Excel.

How much does a Intern Package Development (FA & CA) at STMicroelectronics pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Intern Package Development (FA & CA) role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Intern Package Development (FA & CA) role?

You can apply directly on STMicroelectronics's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.