ST

Intern Package Development (BLR)

STMicroelectronics

SingaporeInternshipOn-site

Posted 12 Jun 2026

About this role

Assist engineers in performing Board Level Reliability tests and conducting basic failure analysis. Responsibilities include executing shock, drop, vibration, and bend tests while compiling data and completing a work improvement project. Requires a diploma in Microelectronics, Electronic Engineering, or a similar field. Proficiency in Microsoft Excel and English is required, with soldering skills and the ability to understand schematic diagrams being preferred.

What they're looking for

Board Level Reliability TestsFailure AnalysisShock/Drop TestVibration TestBend TestSolderingSchematic Diagram InterpretationMicrosoft Excel

Frequently asked questions

What does a Intern Package Development (BLR) at STMicroelectronics do?

Assist engineers in performing Board Level Reliability tests and conducting basic failure analysis. Responsibilities include executing shock, drop, vibration, and bend tests while compiling data and completing a work improvement project. Requires a diploma in Microelectronics, Electronic Engineering…

What skills does this Intern Package Development (BLR) role need?

Key skills for this role include Board Level Reliability Tests, Failure Analysis, Shock/Drop Test, Vibration Test, Bend Test, Soldering.

How much does a Intern Package Development (BLR) at STMicroelectronics pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Intern Package Development (BLR) role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Intern Package Development (BLR) role?

You can apply directly on STMicroelectronics's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.