About this role
What they're looking for
Frequently asked questions
What does a SiC Process Engineering - Wafer Laser Splitting & Grinding M/F at STMicroelectronics do?
The role focuses on maintaining high product quality and driving the ramp-up of SiC substrate production through laser splitting and grinding processes. Key duties include troubleshooting equipment, qualifying new tools, and ensuring process stability and robustness. Candidates should hold a PhD or …
What skills does this SiC Process Engineering - Wafer Laser Splitting & Grinding M/F role need?
Key skills for this role include SiC Semiconductor Technology, Laser Splitting, Surface Grinding, Troubleshooting, Process Qualification, Data Analysis.
How much does a SiC Process Engineering - Wafer Laser Splitting & Grinding M/F at STMicroelectronics pay?
The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.
Is this SiC Process Engineering - Wafer Laser Splitting & Grinding M/F role remote, hybrid, or on-site?
This role is hybrid, based in Catania.
How do I apply for this SiC Process Engineering - Wafer Laser Splitting & Grinding M/F role?
You can apply directly on STMicroelectronics's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.