Semiconductor Tooling Engineer (Semiconductor Tooling Design) - Lcyl

Mechanical Design Engineer (Semiconductor Tooling Design) 5 days, 8.30am-6.15pm Salary: $3500- $6000 Location: Ubi Company background: Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools Job Responsibilities: Design and development of Semiconductor Tools and mechanical systems. Planning, Scheduling and Costing of Tools and Mechanical Modules Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. Working closely with Electrical, Vision and Software Engineers. Willing to work extended hours in critical phases of project execution. Job Requirements: Diploma or Degree in Mechanical Engineering or related Technical disciplines. Minimum 3 years of design experiences in semiconductor tooling Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus Proficiency with CAD Software is a must . Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage. Cheong Yeat Long | R25145358 The Supreme HR Advisory Pte Ltd | EA 14C7279