Semicon Chip R&D Vice President

Chip R&D Vice President (VP)- Based in Shenzhen/Hong Kong (Shanghai/Chengdu also acceptable) 芯片研发- 副总裁（VP）｜深圳 香港（可上海/成都） Salary- RMB 3.5-4 million/year I. Job Overview The company is at a critical stage of high-performance processor chip R&D and industrialization, and is now recruiting a Vice President (VP) for Chip R&D globally. As one of the company's core technology leaders, this position will be responsible for the overall R&D management of large-scale chip products, leading the team to complete the entire process from architecture design to mass production, and driving the company's next-generation processor products to achieve commercial breakthroughs. Reporting to: CEO Work Location: Shenzhen (Shanghai/Chengdu also acceptable) II. Core Responsibilities 1. Chip R&D System Construction Responsible for the company's large-scale chip product R&D strategic planning and technology roadmap formulation; 2. Coordinate the management of chip front-end, back-end, verification, and software R&D teams; Establish and optimize R&D processes, quality systems, and project management mechanisms. 3. Product Lifecycle Management Lead the entire process of high-performance processor chip development, from definition, architecture design, RTL development, verification, physical implementation to tape-out and mass production deployment; Drive chip products to complete tape- out, packaging, testing, and mass production delivery on schedule; 4. Coordinate upstream and downstream partners and fab resources. 5. Technical Team Building Build and cultivate an international chip R&D team; Attract and manage high-end technical talent; Establish a technical talent pipeline and core R&D capabilities. 6. Technical Decision-Making and Risk Control Participate in major technical roadmap and product planning decisions; Lead the tackling of key technologies; Control R&D risks and ensure timely project delivery. III. Qualifications Education Background Master's degree or above from a 985 univer…