R&D Project Manager | Semicon

The project manager is coordinating mainly hardware and software related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement. In his function is managing projects and sub projects according to the Die Attach Product Innovation Process (DAPI) by considering of proven methods, risk management and standards (Semi S2, Semi S8, CE). Responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project. coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia. In role as sub project manager is the interface for project coordination between the different Rnd locations within Die Attach and also responsible for the series introduction of projects started from other Rnd sites. Education Minimal bachelor degree from Mechatronic, Electrical or Automation. Minimum 2 years work experience, prefer in semiconductor back end with experience in project management. Expertise and methodology Innovative Self-employed and assertive Flexible Systematic and focused Good presentation and communication skills Motivator and team player Knowledge, experience and practice on ESG initiatives is an added nice