Staff Engineer – Process Development, Thin Flim (Cvd/Diffusion), Nand

Job / Role Summary The Staff Engineer delivers module/sub-module ownership in NAND Advanced Thin Films process development, owning defined portions of the process space (dielectric/carbon film processes via CVD/Diffusion) and driving robustness, capability, and integration readiness. Success requires strong hands-on deposition/characterization skills, cross-functional execution discipline, and the ability to translate experimental results into scalable process improvements. Main Responsibilities Process Development & Optimization Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Execute well-designed experiments, analyze data, and translate results into process improvements. Support scaling of dielectric and carbon film processes across nodes and platforms. Module Ownership (Growing Scope) Own defined portions of a process module or sub-module under guidance from senior engineers; track margins, sensitivities, and integration risks. Drive issue resolution for process and tool-related problems within assigned scope. Process Integration & Correlation Work closely with integration and device teams to ensure compatibility and structural/electrical performance. Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root-cause investigations. Tool & Hardware Engagement Build strong hands-on knowledge of dielectric/carbon film equipment behavior; support tool qualifications, upgrades, and transfers; partner with suppliers to improve stability/capability. Other Responsibilities Communicate results clearly through reports, reviews, and data summaries; escalate risks with data-driven recommendations. Mentor junior engineers and contribute to team knowledge sharing. Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work Candidate Profile Minimum Qualifications / Experience PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Demonstrated thin film R&D / PD experience and ability to link process conditions to material properties/device behavior. Must-Have Technical Skills Thin film deposition fundamentals (CVD/Diffusion) and materials/chemistry/process physics. Familiarity with fab metrology and film characterization methods (structural/mechanical/optical/electrical as applicable). Working knowledge of plasma processes, vacuum systems, and chemical reactions. Must-Have Soft Skills Strong execution ownership and structured troubleshooting. Cross-functional collaboration and concise technical communication. Highly Desirable / Preferred Understanding NAND thin film structure and electrical needs. Embody Micron’s core values: People – Respect, develop and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value