Principal Engineer – Process Development, Dry Etch, Nand

Job / Role Summary The Principal Engineer provides technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps for current and future nodes and leading cross-functional execution to solve high-impact structural and device challenges. Success requires deep domain expertise in plasma etch, proven leadership in complex program delivery, and strong vendor engagement to close technology gaps. Main Responsibilities Lead dry etch unit process and critical module development; develop/innovate processes that meet advanced NAND structural and electrical specifications. Lead cross-functional teams to solve complex structural problems and drive alignment across process areas. Present and drive dry etch process and technology roadmaps for current and future technology nodes. Drive advanced scalability solutions for high aspect ratio etches , including pulsing/advanced schemes where applicable. Lead supplier head-to-heads and vendor engagements to accelerate process/hardware solutions. Other Responsibilities Provide technical mentorship and act as a resource for peers in dry etch technology and project execution. Provide critical status and risk updates to leadership stakeholders. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Candidate Profile Minimum Qualifications / Experience PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Significant dry etch PD/R&D experience with evidence of leading complex projects and cross-functional delivery (the current Staff/Principal requisition uses MS/PhD and BS experience ranges). Must-have technical skills Deep dry etch technology fundamentals (plasma physics/chemistry, reactor types/chemistries) and ability to apply mechanistic reasoning to outcomes. Strong SPC/DOE/statistical analysis and structured RCA. Must-have soft skills Technical leadership through influence; ability to drive alignment and execution across multiple stakeholders and sites. Strong communication and ability to present roadmaps and program updates. Highly desirable / preferred Data science basics / Python and AI-enabled analysis capability. Embody Micron’s core values: People – Respect, develop and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value