Staff Engineer, Nand Td, Rda

Required Responsibilities • Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes. • Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects. • Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR). • Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions. • Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership. • Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield. • Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e-beam inspection capabilities. • Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites. • Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain. • Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity. Key Responsibilities • Serve as the technical lead for RDA methodologies and execution within NAND TD. • Perform root cause analysis using statistical, image-based, and data-driven techniques. • Develop, own, and communicate inspection and defect detection technology roadmaps. • Define program health metrics and drive continuous improvement initiatives (CIP). • Lead tool anomaly investigations, quarantine decisions, and corrective action planning. • Collaborate globally to align Best Known Methods (BKM) across sites. Stakeholder Collaboration • Technology Development (TD) Process and Integration teams • Yield Analysis and Data Science organizations • Global Manufacturing and Operations • Inspection/metrology equipment suppliers • Program and engineering leadership across regions Requirements : • Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years. • Minimum 1 year of hands-on RDA experience in semiconductor manufacturing or equipment engineering. • Demonstrated expertise in defect inspection, process monitoring, and yield learning. Technical Competencies • Realtime Defect Analysis (RDA) systems and workflows. • Optical and e-beam inspection technologies. • Statistical data analysis, correlation development, and large dataset interpretation. • Semiconductor process integration and technology development. • Root cause analysis and systematic problem solving (e.g., 8D, DMAIC). Leadership & Behavioral Competencies • Recognized technical authority with the ability to influence without direct authority. • Strong mentoring and coaching mindset with proven talent development outcomes. • Clear, concise communication skills across technical and executive audiences. • Ownership-driven, execution-focused; comfortable operating in ambiguity. Impact & Success Measures • Reduced defect-related yield loss and faster learning cycles. • On-time qualification and adoption of next-generation inspection capabilities. • Uplift in organizational RDA skill depth and succession pipeline. • Alignment of inspection strategy and capability to future NAND nodes.