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Intern - HIG HBM PACKAGE PSE

Micron Technology

SingaporeInternshipOn-site

Posted 15 Jun 2026

About this role

The intern will set up an HBM defect library by documenting electrical and physical fail signatures. They will also create a standardized tracking dashboard for defect fail modes across different test flows. Candidates should have basic knowledge of semiconductors and physics along with Python coding skills. A Master's degree in Electrical Engineering, Material Science, or Semiconductor Technology is preferred.

What they're looking for

Python CodingSemiconductor KnowledgePhysics KnowledgeData DashboardingElectrical Fail Signature Analysis

Frequently asked questions

What does a Intern - HIG HBM PACKAGE PSE at Micron Technology do?

The intern will set up an HBM defect library by documenting electrical and physical fail signatures. They will also create a standardized tracking dashboard for defect fail modes across different test flows. Candidates should have basic knowledge of semiconductors and physics along with Python codin…

What skills does this Intern - HIG HBM PACKAGE PSE role need?

Key skills for this role include Python Coding, Semiconductor Knowledge, Physics Knowledge, Data Dashboarding, Electrical Fail Signature Analysis.

How much does a Intern - HIG HBM PACKAGE PSE at Micron Technology pay?

The employer did not list a salary for this role. Most similar Singapore roles publish their band on the job page.

Is this Intern - HIG HBM PACKAGE PSE role remote, hybrid, or on-site?

This role is on-site, based in Singapore.

How do I apply for this Intern - HIG HBM PACKAGE PSE role?

You can apply directly on Micron Technology's careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.