Research Fellow (Flexible Electronics)

The School of Materials Science and Engineering (MSE) provides a vibrant and nurturing environment for staff and students to carry out inter-disciplinary research in key areas such as Computational Materials Science, Characterisation Materials Science, Defence Composite Materials, Functional Composite Materials, Energy, Nanomaterials, Low Dimensional Materials, Biomaterials Materials, Biological Materials, Bioinspired Materials and Sustainable Materials. For more details, please view https://www.ntu.edu.sg/mse/research . We are seeking a highly motivated and interdisciplinary Research Fellow to support the development of bonding and advanced packaging technologies for advanced electronic and flexible devices. The role will involve the design, fabrication, and characterization of bonded interfaces and interconnects, with emphasis on bonding, interfacial reaction mechanisms, and reliable integration for advanced electronic and flexible devices. The successful candidate will contribute to NTU’s research in advanced materials and soft device-related platforms by bridging polymer science, supramolecular chemistry, and interfacial engineering. Key Responsibilities: Design, fabricate, and characterize bonded joints and interconnects in advanced and dissimilar-material systems using low-temperature bonding and related joining methods. Develop bonding processes and interlayer/material systems for advanced packaging and device integration. Conduct microstructural, chemical, and mechanical characterization using appropriate analytical techniques. Collaborate with interdisciplinary researchers to integrate bonding solutions into devices, packaging, or system-level platforms where relevant. Assist in manuscript preparation, conference presentations, grant development, and reporting to funding agencies and collaborators. Mentor junior researchers and students, and support general laboratory management, procurement and equipment coordination where required. Job Requirements: PhD in Materials Science, Mechanical Engineering, Microelectronics, Chemistry, or a related discipline. Demonstrated research experience in diffusion bonding, brazing, soldering, interfacial joining, or low-temperature bonding of advanced materials. Strong background in metallurgical interface engineering, joint design, and characterization of bonded interfaces. Experience in one or more of the following areas is highly desirable: low-temperature bonding, advanced/electronic packaging, heterogeneous integration, dissimilar-material joining, interfacial reaction and diffusion, or microstructure-property relationships in joints. Familiarity with microstructural, chemical, and mechanical characterization methods for materials and interfaces. Strong publication record in reputable journals and the ability to independently drive research tasks to completion. Good written and oral communication skills, with the ability to work effectively in a multidisciplinary and collaborative research environment. We regret to inform that only shortlisted candidates will be notified.