Associate Engineer (Sputter / Photolithography / Descum)

Responsibilities; Line sustaining for dry process (i.e. Sputter, Photolithography and Descum) Support lot dispositions and OCAP executions Involve in Continuous Improvement Projects Working with QM Dept. to response customer inquires and issues Execute CIP or project handling that contributes yield & cost efficiency improvement Ensure SPC is maintain and in control Support new material evaluation and new tool set up Requirements; Diploma in electronics or related disciplines Preferably with minimum 2 years' experience in Wafer bumping process running high volume Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)