Application Engineer – Electronics

About the Company A global leader in simulation-driven innovation with over 40 years of expertise, delivering advanced engineering solutions, digital workflows, and AI/ML-integrated CAE technologies across industries such as aerospace, defense, semiconductors, automotive, and healthcare. About the Role We are seeking a detail-oriented and technically skilled Application Engineer – Electronics, with strong expertise in SI/PI, EMI/EMC, and RF systems. The role involves aligning simulation solutions with customer challenges in SERDES, DDR, power electronics, antenna arrays, cosite interference, radomes, and FSS. It demands both domain depth and broad technical oversight across high-frequency electromagnetics. Responsibilities Lead and mentor a multi-domain presales team across SI/PI, EMI/EMC, and RF modalities. Architect and oversee delivery of simulation solutions involving high-speed digital design, interference mitigation, and RF component optimization. Support complex RF design evaluations including antenna arrays, cosite placement, radome interaction, and C-band satellite payload integration. Guide engagements requiring modeling of SERDES links, DDR buses, IGBT-based power modules, parasitics (R, L, G, C), and EMC shielding. Collaborate with Go-To-Market (GTM) consultants to align simulation positioning with strategic roadmaps. Represent the company in technical reviews, executive briefings, and key customer engagements. Qualifications Master’s degree in Electrical, Electronics, Communication Engineering, or a related field. Minimum 4 years of experience in SI/PI, EMI/EMC, RF system design or simulation. Required Skills Deep understanding of Ansys software, FEM, and CAE applications. Strong knowledge of electronic system design across component and system levels. Exposure to tools such as HFSS, Slwave, EMA3D, CST, ADS, Feko, or similar. Demonstrated ability to lead technical teams and manage cross-functional collaboration. Preferred Skills Specialty in modeling across domains such as Satellite RF Communication, Stealth Technology, High-Speed Digital Communications, Power Modules, and Flex PCBs. Exposure to semiconductor and 3DIC technology modeling. Location: Singapore Experience Required: 4+ years