SC

Principal Engineer (R&D)

Stats Chippac Management Pte. Ltd.

D27 Sembawang, YishunFull TimeS$7,500 – S$12,500/mo

Posted 17 Jul 2026

About this role

Purpose of the Job To establish, develop, and sustain technology platforms, business processes, and systematic roadmaps for unit processes, materials, equipment, and manufacturing capabilities that support New Packages (NP), Evolutionary Packages (EP), New Technologies (NT), and Emerging Technologies (ET) in alignment with the company’s technology and package development roadmap. The role drives technology scouting, capability assessment, material and equipment strategy, and the successful implementation of advanced manufacturing technologies to enable future product development and business growth. Key Job Accountabilities • Develop and implement technology roadmaps for processes, materials, equipment, and manufacturing platforms to support current and future product requirements. • Establish and qualify new process capabilities, equipment platforms, tooling solutions, and materials to support advanced packaging and next-generation manufacturing technologies. • Lead technology evaluation, benchmarking, and capability assessments of materials, equipment, tooling, and manufacturing solutions in collaboration with suppliers, customers, and internal stakeholders. • Define and maintain systematic approaches for material selection, process development, equipment qualification, and technology deployment. • Drive new equipment introduction, factory implementation, commissioning, and capability qualification for R&D and New Product Introduction (NPI) programs. • Assess process, equipment, and material readiness to support new technology and product development requirements. • Conduct technical feasibility studies, risk assessments, and gap analyses to identify capability requirements and development opportunities. • Collaborate closely with Business Units, Product Development, Process Engineering, Manufacturing, and external partners to align technology strategies with business and customer needs. • Lead cross-functional technology development projects from concept through qualification and production readiness. • Utilize statistical methods, design of experiments (DOE), and data-driven approaches to evaluate and optimize process and equipment performance. • Establish best practices, standards, and governance for technology platform development and deployment. • Support technology transfer activities and ensure successful integration of new capabilities into manufacturing operations. • Monitor industry trends and emerging technologies to identify opportunities for innovation and competitive advantage. Required Experience and Qualifications • Bachelor's Degree or above in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline. • Minimum 10 years of relevant experience in semiconductor, advanced manufacturing, electronics packaging, or related industries, with strong exposure to process and equipment engineering. • Strong knowledge of advanced packaging technologies, wafer-level processes, heterogeneous integration, assembly processes, and manufacturing technologies. • Experience in technology development, equipment qualification, capability assessment, and process optimization. • Working knowledge of Design of Experiments (DOE), Statistical Process Control (SPC), Lean Six Sigma, DMAIC, and statistical analysis tools such as JMP or equivalent. • Proven experience in leading new technology implementation and equipment deployment projects in manufacturing environments. • Strong project leadership and stakeholder management skills, with the ability to influence across functions, organizations, and cultures. • Excellent analytical, troubleshooting, and problem-solving capabilities. • Strong communication, presentation, technical writing, and interpersonal skills. • Experience engaging with customers, suppliers, technology partners, and cross-functional teams. • Self-driven and capable of working independently in a fast-paced, dynamic environment with minimal supervision.

What they're looking for

Materials ScienceProcess & Technology DevelopmentProcess ImprovementNpi

About Stats Chippac Management Pte. Ltd.

Industry: Professional & technical services

Frequently asked questions

What does a Principal Engineer (R&D) at Stats Chippac Management Pte. Ltd. do?

Purpose of the Job To establish, develop, and sustain technology platforms, business processes, and systematic roadmaps for unit processes, materials, equipment, and manufacturing capabilities that support New Packages (NP), Evolutionary Packages (EP), New Technologies (NT), and Emerging Technologie…

What skills does this Principal Engineer (R&D) role need?

Key skills for this role include Materials Science, Process & Technology Development, Process Improvement, Npi.

How much does a Principal Engineer (R&D) at Stats Chippac Management Pte. Ltd. pay?

This role lists a salary of S$7,500 – S$12,500 per month.

Is this Principal Engineer (R&D) role remote, hybrid, or on-site?

The listing is based in D27 Sembawang, Yishun. Check the posting for remote or hybrid options.

How do I apply for this Principal Engineer (R&D) role?

You can apply directly on Stats Chippac Management Pte. Ltd.'s careers page. ApplyLah can tailor your résumé and cover letter to this exact role in seconds first.